UNISOC Tangula T770 vs HiSilicon Kirin 960s vs MediaTek Dimensity 800U

UNISOC Tangula T770

The Unisoc T770 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.

The chip is manufactured in the modern 6nm process.

HiSilicon Kirin 960s

The HiSilicon Kirin 960S is an ARM based mid-range octa-core SoC for smartphones and tablets, which was introduced with the 2018 10.5-inch Huawei MediaPad M5. Compared to the normal Kirin 960, the 960S offers an additional NPU for AI calculations from the Kirin 970. Looks like to be slower clocked than the older Kirin 960.

Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.

MediaTek Dimensity 800U

The Mediatek Dimensity 800U is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the Dimensity 820, the 800U offers lower clocked A76 cores and a slower GPU.

The Dimensity 800U is manufactured in the modern 7nm process and should be very power efficient.