Intel Core i7-8706G vs Intel Core i7-1195G7

Intel Core i7-8706G

The Intel Core i7-8706G is a fast quad-core processor for notebooks based on the Kaby Lake architecture and was announced in January 2018. similar to the Core i7-7920HQ it integrates four processor cores clocked at 3.1 - 4.1 GHz. As a speciality the package also contains a Vega based graphics card from AMD (with 20 CUs = 1,280 shaders at 1011 MHz) and 4 GB HBM2 graphics memory. The CPU is still produced in 14nm as the i7-7920HQ. Similar to the Core i7-8705G, but with support for vPro (the only Kaby Lake-G CPU with vPro support). Compared to the high-end Kaby Lake-G models, the i7-8706G only features 20 instead of 24 CUs for the Vega GPU and a lower TDP of 65 versus 100 Watt.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the i7-7920HQ, the i7-8706G should be slightly faster due to the HBM2 memory and the 65 Watt TDP. The performance is therefore sufficient even for very demanding tasks and on par with powerful desktop quad-core processors.

Graphics

In addition to the Intel HD Graphics 630 in the CPU die, the Core i7-8809G also offers an AMD Radeon RX Vega M GL graphics card with 20 CUs and therefore double the amount of the current mobile Ryzen APUs (e.g. Ryzen 7 2700 with 10 CUs) but 4 less than the Vega M GH of the high end models.

Contrary to Skylake, Kaby Lake now supports hardware decoding for H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The 8809G should also support HDCP 2.2, but for HDMI 2.0, it most likely needs a converter from DisplayPort.

Power Consumption

The CPU chip is manufactured in an improved 14nm process with FinFET transistors. It is rated at a TDP of around 65 Watt and therefore is only suited for laptops with good cooling solutions. Compared to laptops with Core i7-H quad cores and dedicated graphics cards, the i7-8706G based models can be built with smaller chassis.

Intel Core i7-1195G7

The Intel Core i7-1195G7 is a quad-core SoC from the Tiger Lake-UP3 product family designed for thin laptops and Ultrabooks that was introduced in 2021. It integrates four Willow Cove processor cores (8 threads thanks to Hyper-Threading). The base clock (minimum) depends on the configured TDP and can range from 1.3 GHz (12 Watt TDP) up to 2.9 GHz (28 W). The Turbo on one core can reach up to 5 GHz (Turbo Boost 3.0). All cores can reach up to 4.6 GHz. The i7-1195G7 is part of the Tiger Lake UP3 refresh and is the fastest CPU of the Tiger-Lake U line.

Furthermore, Tiger Lake SoCs supports four lanes of PCIe 4, AI hardware acceleration, and the partial integration of Thunderbolt 4/USB 4 and Wi-Fi 6E in the chip.

The 1195G7 integrates the Intel Iris Xe graphics adapter with 96 EUs clocked at 400 - 1400 MHz. The GPU and CPU can together use the 12 MB of L3 cache.

Performance

The average 1195G7 in our database matches the Intel Core i5-10300H in multi-thread performance while, perhaps surprisingly, lagging behind the AMD Ryzen 3 5300U. The makes the i7 a decent lower mid-range chip, as of early 2022. It'll run most apps with virtually no delays or slowdowns which is what the vast majority of users wants.

Thanks to its decent cooling solution and a long-term CPU power limit of slightly more than 30 W, the VAIO SX14 VJS144X0111K is among the fastest laptops built around the 1195G7 that we know of. It can be about 40% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Core i7 series chip has a default TDP of 12 W to 28 W, the expectation being that laptop makers will go for a higher value in exchange for higher performance. Either way, that's a tad too high to allow for passively cooled designs.

The i7-1195G7 is built with Intel's 3rd generation 10 nm process marketed as SuperFin for below average, as of early 2023, energy efficiency.