Intel Core i7-11375H vs Apple M3 Max 14-Core
Intel Core i7-11375H
► remove from comparisonThe Intel Core i7-11375H is a high end quad core SoC for thin and light gaming laptops and mobile workstations. It is based on the Tiger Lake H35 generation and was announced early 2021. It integrates four Willow Cove processor cores (8 threads thanks to HyperThreading). The base clock speed depends on the TDP setting and can vary from 3 (28 W TDP) to 3.3 GHz (35 W). Compared to the i7-11370H, the only difference is the additional Turbo Boost 3.0 for a single core. With it, the 11375H can clock up to 5 GHz. Two cores can clock up to 4.8 GHz (as the 11370H) and all four cores can reach up to 4.3 GHz. The 11375H can use the whole 12 MB level 3 cache.
The processor performance of the i7 should be very similar to the i7-11370H. Only single threaded short workloads will be slightly faster. The multi-threaded performance should be clearly higher than the old Core i5-10400H (Comet Lake, fastest quad core of the 10th gen) due to the new processor architecture. The similar Core i7-1185G7 offers similar specs as the 11370H but a lower TDP and therefore also lower (sustained) performance.
The SoC also included the improved Xe graphics adapter with all 96 EUs clocked at up to 1350 MHz.
Furthermore, Tiger Lake SoCs add PCIe 4 support (four lanes), AI hardware acceleration, and the partial integration of Thunderbolt 4/USB 4 and Wi-Fi 6 in the chip.
The chip is produced on the improved 10nm process (called 10nm SuperFin) at Intel, which should be comparable to the 7nm process at TSMC (e.g. Ryzen 4000 series).
All articles on Tiger Lake can be found on our Tiger Lake architecture hub.
Apple M3 Max 14-Core
► remove from comparisonThe Apple M3 Max 14 core CPU is a system on a chip (SoC) from Apple for notebooks that was introduced towards the end of 2023. It integrates a new 14-core CPU with 10 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a more powerful 16-core variant with 40 GPU cores.
Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs.
The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the cheaper model, 30 of the chip's 40 cores are used and support up to 5 displays simultaneously (internal and 4 external).
GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 36 and 96 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).
The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.
Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).
The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max).
Model | Intel Core i7-11375H | Apple M3 Max 14-Core | ||||||||||||||||||||||||||||||||||||||||
Series | Intel Tiger Lake | Apple Apple M3 | ||||||||||||||||||||||||||||||||||||||||
Codename | Tiger Lake-H35 | |||||||||||||||||||||||||||||||||||||||||
Series: Apple M3 |
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Clock | 3300 - 5000 MHz | 2748 - 4056 MHz | ||||||||||||||||||||||||||||||||||||||||
L1 Cache | 320 KB | |||||||||||||||||||||||||||||||||||||||||
L2 Cache | 5 MB | |||||||||||||||||||||||||||||||||||||||||
L3 Cache | 12 MB | |||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 4 / 8 | 14 / 14 10 x 4.1 GHz Apple M3 P-Core 4 x 2.7 GHz Apple M3 E-Core | ||||||||||||||||||||||||||||||||||||||||
TDP | 35 Watt | 78 Watt | ||||||||||||||||||||||||||||||||||||||||
Technology | 10 nm | 3 nm | ||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | |||||||||||||||||||||||||||||||||||||||||
Socket | BGA1449 | |||||||||||||||||||||||||||||||||||||||||
Features | DDR4-3200/LPDDR4x-4266 RAM, PCIe 4, 4 GT/s bus, DL Boost, GNA, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, VMX, SMEP, SMAP, EIST, TM1, TM2, Hyper-Threading, Turbo, SST, AES-NI, RDRAND, RDSEED, SHA | ARMv8 Instruction Set | ||||||||||||||||||||||||||||||||||||||||
iGPU | Intel Iris Xe Graphics G7 96EUs (400 - 1350 MHz) | Apple M3 Max 30-Core GPU | ||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | ARM | ||||||||||||||||||||||||||||||||||||||||
$482 U.S. | ||||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||
Manufacturer | ark.intel.com | www.apple.com | ||||||||||||||||||||||||||||||||||||||||
Transistors | 92000 Million |