Intel Core i3-1125G4 vs Qualcomm Snapdragon S4 Plus MSM8227

Intel Core i3-1125G4

The Intel Core i3-1125G4 is a 28 W quad-core SoC for laptops and Ultrabooks of the Tiger Lake family (UP3) that was introduced in September 2020. It integrates four Willow Cove processor cores (8 threads thanks to Hyper-Threading). Each core can clock from 2 GHz (guaranteed base speed @ 28 W) to 3.7 GHz (single-core boost). All cores at once can clock at up to 3.3 GHz. The faster Core i7 models offer more Level 3 cache (12 versus 8 MB in the i5) and higher clocked cores.

Another novelty is the integrated Xe GPU based on the completely new Gen 12 architecture. In the i3-1125G4 Intel names the GPU UHD Graphics and offers only 48 of the 96 EUs clocked at 400 - 1250 MHz. The GPU and CPU can together use the 8 MB of L3 cache.

Furthermore, Tiger Lake SoCs add PCIe 4 support (four lanes), AI hardware acceleration, and the partial integration of Thunderbolt 4 / USB 4 and Wi-Fi 6 in the chip.

Performance

While we have not tested a single laptop built around the 1125G4 as of October 2023, we expect the chip's multi-thread performance to be 10% to 20% lower than that of the Core i5-1135G7 (4 cores, 8 threads, somewhat higher clock speeds).

Your mileage may vary depending on how high the CPU power limits are and how competent the cooling solution of your system is.

Power consumption

This Core i3 series chip has a default TDP of 12 W to 28 W, the expectation being that laptop makers will go for a higher value in exchange for higher performance. Either way, that's a little too high to allow for passively cooled designs.

The i3-1125G4 is manufactured on Intel's third-gen 10 nm process marketed as SuperFin for average, as of early 2023, energy efficiency.

Qualcomm Snapdragon S4 Plus MSM8227

The Qualcomm Snapdragon S4 MSM8277 is a mid-range SoC for smartphones and tablets (mostly Android based). It contains two Krait (improved ARM Cortex-A9) CPU cores at 1.0 GHz and a Adreno 305 graphics card. A memory controller and radio elements (excluding LTE) are also included. The chip is produced in 28nm LP process at TSMC.