Intel Core i3-10100F vs AMD E-240 vs AMD E1-1200
Intel Core i3-10100F
► remove from comparisonThe Intel Core i3-10100F is an entry level quad-core processor for desktop PCs based on the Comet Lake-S architecture. It offers four cores clocked at 3.6 - 4.3 GHz with HyperThreading / SMT support (8 threads). The CPU is still manufactured on 14nm++ and does not feature an integrated graphics card. Compared to the older Coffee Lake Core i3-9100F, the i3-10100F offers a 100 MHz higher Boost speed, HyperThreading and support for faster DDR4 memory (2666 MHz).
Performance
While we have not tested a single system powered by the 10100F as of August 2023, it's reasonable to expect the chip to be just slightly faster than the Core i5-10200H.
Intel specifies the CPU with a TDP of 65 Watt. For desktops that means that the processor won't need big cooling solutions and can be used in small cases.
AMD E-240
► remove from comparisonThe AMD E-240 (codename Zacate) is a single core processor for small notebooks and netbooks. It offers a relatively powerful integrated graphics card and a single channel DDR3-1066 memory controller.
Inside the E-240 one Bobcat core (the second one is deactivated) can access 512KB level 2 cache. In comparison to the Atom processors, the Bobcat architecture uses an "out-of-order" execution and is therefore faster at the same clock speed. However, the performance is far worse than similar clocked Penryn (Celeron) or Danube (AMD V-Series) cores. On average the cpu performance of the E-240 should be between a 2 GHz Atom and a Celeron single core with 1.1 GHz.
The integrated Radeon HD 6310 graphics card offers 80 shaders and an UVD3 video processor. Compared to the slow GMA 3150 in the Atom processors, the HD6310 offers a lot more performance and is about as fast as the Nvidia ION graphics solution.
The power consumption is rated with a TDP of 18 Watt by AMD.
AMD E1-1200
► remove from comparisonThe AMD E1-1200 (codename Zacate, not to be confused with the Ryzen 3 1200 from 2017) is a dual-core processor for small notebooks and netbooks. It is produced on a 40 nm process and offers a relatively powerful integrated GPU and a single channel DDR3-1066 memory controller. Compared to the older E-300, which is based on the same chip, the E1-1200 offers a 100 MHz higher CPU clock rate.
The E1-1200 has two Bobcat cores running at 1.4 GHz (no Boost here) that can access 512 KB of L2 cache per core. In comparison to the Atom processors, the Bobcat architecture uses an "out-of-order" execution and is therefore faster at the same clock speed.
The integrated Radeon HD 7310 GPU offers 80 shaders and an UVD3 video decoder. Compared to the slow GMA 3150 in the Atom processors, an HD 7310 offers a lot more performance and is about as fast as the Nvidia ION graphics solution. The HD 7310's clock rate is 500 MHz to be very similar to the HD 6310 (488 - 500 MHz depending on the APU).
Performance
The average E1-1200 in our database is in the same league as the Celeron N2807 and the AMD E-300, as far as multi-thread benchmark scores are concerned. This is an outrageously slow chip, as of mid 2022.
Power consumption
This E-series APU has a default TDP of 18 W, meaning an active cooling solution is pretty much a must.
The AMD E1-1200 is built with a 40 nm process for very, very, very low, as of 2022, energy efficiency.
Model | Intel Core i3-10100F | AMD E-240 | AMD E1-1200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Comet Lake | AMD E-Series | AMD E-Series | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Comet Lake | Zacate | Zacate | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: E-Series Zacate |
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Clock | 3600 - 4300 MHz | 1500 MHz | 1400 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 256 KB | 64 KB | 128 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 1 MB | 512 KB | 1 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 6 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 4 / 8 | 1 / 1 | 2 / 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 65 Watt | 18 Watt | 18 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 14 nm | 40 nm | 40 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 126 mm2 | 75 mm2 | 75 mm2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | LGA1200 | FT1 BGA 413-Ball | FT1 (BGA413) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | DDR4-2666 RAM, PCIe 3, 8 GT/s bus, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, AVX2, FMA3 | MMX(+), SSE(1,2,3,3S,4A), AMD-V | DDR3-1066 RAM (sin. chan.), PCIe 2 [?], MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
$122 U.S. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | ark.intel.com | www.amd.com | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | AMD Radeon HD 7310 |