Qualcomm Snapdragon X Plus X1P-42-100 vs Apple M3 Max 16-Core

Qualcomm Snapdragon X Plus X1P-42-100

The Snapdragon X Plus X1P-42-100 is a relatively affordable ARM architecture processor (SoC) for use in Windows laptops that is rumored to debut some time in H2 2024. The X1P-42-100 is thought to have 8 Oryon CPU cores (8 threads) running at a not yet known clock speed of at least 3.0 GHz. As far as other key features are concerned, the X Plus probably comes with the same 3.8 TFLOPS Adreno X1-85 GPU, 45 TOPS Hexagon NPU and LPDDR5x-8448 memory controller that its bigger and smarter brother, the X1P-64-100, employs.

Architecture and Features

Qualcomm Oryon cores are in part based on Nuvia IP; they most likely make use of the ARM v8.7 microarchitecture. Much like modern AMD and Intel processors, the Snapdragon chip is compatible with USB 4 and thus with Thunderbolt 4 but it remains to be seen if it is is compatible with GeForce or Radeon discrete graphics cards.

The SoC is said to have 8 PCIe 4 and 4 PCIe 3 lanes for connecting various kinds of devices. NVMe SSDs are supported with a throughput of up to 7.9 GB/s. A 45 TOPS NPU for accelerating AI workloads is most likely included.

This X Plus chip does not make use of the same die that the X1P-64-100, X1E-78-100, X1E-80-100, X1E-84-100 are based on.

Performance

The faster X1P-64-100 (10 CPU cores running at higher clock speeds) is about as fast as the Intel Core i7-13700H and the 9-core Apple M4 are in multi-thread workloads. This means the X1P-42-100 will most likely be about as fast as the Intel Core i7-12650H and the AMD Ryzen 7 PRO 6850H which is not bad at all for what is supposedly an almost budget CPU.

Like any other Windows on ARM platform, the Snapdragon X chip works best with applications and games compiled specifically for ARM processors. If making use of the built-in x86 to ARM emulation mode, a performance penalty of about 20% is to be expected.

Graphics

The 3.8 TFLOPS Adreno X1-85 GPU is DirectX 12-enabled but not DirectX 12 Ultimate-enabled, despite featuring VRS and ray tracing support. The 3.8 TFLOPS of performance that it supposedly delivers pale in comparison to the slowest current-generation professional Nvidia Ada graphics card for laptops, the RTX 500 Ada, that delivers up to 9.2 TFLOPS.

Its gaming performance is rather underwhelming; while slightly faster than the aging Iris Xe (96 EUs), the Adreno is not fast enough to outpace the Radeon 780M meaning there is little point in comparing it with full-fat discrete graphics cards. Baldur's Gate 3, a triple-A title released in 2023, is pretty much unplayable at 1080p / Low. GTA V, a game that saw the light of day in 2015, is playable at 1080p / High.

The Qualcomm iGPU will let you use up to 3 UHD 2160p monitors simultaneously. 2160p120 integrated displays are supported, as are the popular AV1, HEVC and AVC video codecs (both decoding and encoding). The hardware does not support the VVC codec; that feature remains a Lunar Lake exclusive for now.

Power consumption

The X1P-42-100 is most likely going to be less power-hungry than its more powerful X Elite brothers. Expect to see anything between 10 W and 35 W under long-term workloads because that's what Ryzen U chips normally consume.

The SoC is built with a 4 nm TSMC process for decent, as of H1 2024, energy efficiency.

Apple M3 Max 16-Core

The Apple M3 Max (16 Core) is a system on a chip (SoC) from Apple for notebooks that was launched towards the end of 2023. It integrates a new 16-core CPU with 12 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a slimmed-down 14-core variant with a 30-core GPU.

Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs (such as a Core i9-13900HX).

The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 40 cores of the chip are used and support up to 5 displays simultaneously (internal and 4 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 48, 64 and 128 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max). Under load, the CPU part consumes up to 56 watts, the chip can use a total of 78 watts.