Qualcomm Snapdragon 8cx vs Apple M3 Max 16-Core

Qualcomm Snapdragon 8cx

The Qualcomm Snapdragon 8cx Compute Platform (or SD8cx) is a ARM based SoC for Windows laptops. It integrates a similar CPU part as the Snapdragon 855 (same cores but without the Prime Core feature) and is manufactured in 7nm at TSMC. The 4 Kryo 495 Gold cores are based on the ARM Cortex-A76 architecture (for performance) and clocked at 2.84 GHz under load (no single core Turbo). The 4 Kryo 495 Silver cores are small ARM Cortex-A55 cores for power efficiency and clocked at 1.9 GHz under load. According to Qualcomm, the clock speed should not be reduced under constant load with typical (fanless) cooling. The integrated X24 LTE modem supports up to 2 Gbps download speeds. Furthermore, the SoC integrates ac-Wifi and a dual-channel 32-bit 1866 MHz LPDDR4x memory controller.

The processor performance should be similar to a Intel Core i5 8th gen U-series (e.g. i5-8250U) according to Qualcomm. However, this is only the case for native ARM64 compiled Windows apps which are not that many (in mid 2019). 32 bit applications and games for AMD/Intel run in a rather slow emulation and 64 bit apps wont start at all (but an emulator should come in Windows in 2021).

The integrated Adreno 680 graphics card is a beefier version of the Adreno 640 in the Snapdragon 855 and should be twice as fast as the old Adreno 630 (in Windows laptops) and offer a 60% higher efficiency.

The chip is very power efficient as its produced at Samsung in the modern 7 nm process (7LPP). Therefore, laptops using the Snapdragon 8cx can be passively cooled (no fan) and should not throttle under constant load.

Apple M3 Max 16-Core

The Apple M3 Max (16 Core) is a system on a chip (SoC) from Apple for notebooks that was launched towards the end of 2023. It integrates a new 16-core CPU with 12 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a slimmed-down 14-core variant with a 30-core GPU.

Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs (such as a Core i9-13900HX).

The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 40 cores of the chip are used and support up to 5 displays simultaneously (internal and 4 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 48, 64 and 128 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max). Under load, the CPU part consumes up to 56 watts, the chip can use a total of 78 watts.