Qualcomm Snapdragon 8 Gen 2 vs UNISOC Tangula T760 vs MediaTek Dimensity 6100+

Qualcomm Snapdragon 8 Gen 2

The Qualcomm Snapdragon 8 Gen 2 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2022 and manufactured in 4 nm at TSMC (N4P). It integrates four different CPU clusters. A fast and big prime core based on the ARM Cortex-X3 architecture and clocked at up to 3.2 GHz for 64 bit applications. Two more ARM Cortex-A715 based performance cores clocked at up to 2.8 GHz (also only for 64 bit apps). Two more Cortex-A710 performance cores at up to 2.8 GHz that can also be used for older apps and three efficiency cores (ARM Cortex-A510 with up to 2 GHz). All cores can use the shared 8 MB level 3 cache.

Thanks to the new architecture and high clock rates, the SD 8 Gen 2 is the fastest mobile CPU for Android based devices and is only topped by current Apple SoCs like the Apple A16 (see benchmarks below).

The chip also integrates a Hexagon accelerator for AI workloads (tensor, scalar and vector). Qualcomm states that its one of the first chips with INT4 support and up to 4.35x performance compared to the previous generation. 

The 18-Bit-Spectra ISP is able to process photos with up to 200 MP and work with videos up to 8k30 (including 10-bit, HDR10+, HLG and Dolby Vision).

A big improvement of the Snapdragon 8 G2 is the integrated Adreno 740 GPU, that now supports Hardware Raytracing and tops even the iGPU in the Apple A16.

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X70 5G modem is also new as is the FastConnect 7800 modem with Wi-Fi 7 and Bluetooth 5.3 support.

UNISOC Tangula T760

The Unisoc T760 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Four fast ARM Cortex-A76 cores clocked at up to 2 GHz and four small ARM-Cortex-A55 cores at again up to 2 GHz for efficiency. The faster T770 SoC offers higher clocked A76 cores in comparison (up to 2.5 GHz for a single core).

One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.

The chip is manufactured in the modern 6nm process.

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.