Qualcomm Snapdragon 8 Gen 2 vs Apple M3 Pro 11-Core

Qualcomm Snapdragon 8 Gen 2

The Qualcomm Snapdragon 8 Gen 2 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2022 and manufactured in 4 nm at TSMC (N4P). It integrates four different CPU clusters. A fast and big prime core based on the ARM Cortex-X3 architecture and clocked at up to 3.2 GHz for 64 bit applications. Two more ARM Cortex-A715 based performance cores clocked at up to 2.8 GHz (also only for 64 bit apps). Two more Cortex-A710 performance cores at up to 2.8 GHz that can also be used for older apps and three efficiency cores (ARM Cortex-A510 with up to 2 GHz). All cores can use the shared 8 MB level 3 cache.

Thanks to the new architecture and high clock rates, the SD 8 Gen 2 is the fastest mobile CPU for Android based devices and is only topped by current Apple SoCs like the Apple A16 (see benchmarks below).

The chip also integrates a Hexagon accelerator for AI workloads (tensor, scalar and vector). Qualcomm states that its one of the first chips with INT4 support and up to 4.35x performance compared to the previous generation. 

The 18-Bit-Spectra ISP is able to process photos with up to 200 MP and work with videos up to 8k30 (including 10-bit, HDR10+, HLG and Dolby Vision).

A big improvement of the Snapdragon 8 G2 is the integrated Adreno 740 GPU, that now supports Hardware Raytracing and tops even the iGPU in the Apple A16.

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X70 5G modem is also new as is the FastConnect 7800 modem with Wi-Fi 7 and Bluetooth 5.3 support.

Apple M3 Pro 11-Core

The Apple M3 Pro 11 Core is a system on a chip (SoC) from Apple for notebooks that was introduced late 2023. It integrates 11 of the 12 CPU cores with 5 of 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz.

Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). Thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.

The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the entry-level model, only 14 of the chip's 18 cores are used and support up to 3 displays simultaneously (internal and 2 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).