Qualcomm Snapdragon 8+ Gen 1 vs Apple M3

Qualcomm Snapdragon 8+ Gen 1

The Qualcomm Snapdragon 8+ Gen 1 Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2022 and manufactured in 4 nm at TSMC. It integrates one “Prime Core” based on a ARM Cortex-X2 architecture clocked at up to 3.2 GHz. Three more performance cores are based on the Cortex-A710 but clocked up to 2.5 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A510 architecture and clocked at up to 1.8 GHz. All cores can use the shared 6 MB level 3 cache.

Compared to the Snapdragon 8 Gen 1, the SoC is now produced in the more power efficient 4nm process at TSMC and offers higher clocked CPU and GPU cores (at a lower power consumption according to Qualcomm).

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X65 5G modem is also new and offers faster transfer rates (up to 10 Gbps download and 3 Gbps upload). The FastConnect 6900 offers support for the current Wifi 6E and Bluetooth 5.2.

Apple M3

The Apple M3 is a system on a chip (SoC) from Apple for notebooks that was introduced in late 2023. It integrates a new 8-core CPU with 4 performance cores with up to 4.06 GHz and 4 efficiency cores running at up to 2.75 GHz. Apple claims that the CPU is up to 20% faster than in the old Apple M2 (3.5 GHz). 

Due to the higher clock speeds and architecture improvements, the processor performance is also significantly better than the M2 in benchmarks (see e.g. Geekbench below) and can keep up with the fastest CPUs in short single-core tests (like the Raptor Lake i9-13950HX).

The M3 also integrates a new graphics adapter with dynamic caching, mesh shading and ray tracing acceleration. According to Apple, it is 20% faster than the GPU in the M2. The chip integrates again 10 GPU cores, but the cheaper variant only offers 8 cores (e.g. in the entry iMac). Furthermore, the GPU only supports 2 displays (an additional 6K60 display to the internal one).

Both GPU and CPU can access the unified memory on the package together. It is still available in 8, 16 and 24 GB variants and offers the same 100 GB/s maximum bandwidth (unlike the Pro models that feature a reduced memory bandwidth). 

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (versus 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated wireless network module only supports Wi-Fi 6E (no Wi-Fi 7) and due to the support of only a single external monitor, the chip also has to make do with no Thunderbolt 4 (Thunderbolt 3 / USB 4 support only for up to 40 Gbit/s).

The chip is manufactured on the current 3nm TSMC process (N3B most likely) and contains 25 billion transistors (+25% vs. Apple M2). The 3nm process should also contribute to the excellent efficiency of the chip. Under load, the M3 CPU consumes approximately 20 Watt.