Qualcomm Snapdragon 8 Gen 1 vs MediaTek Dimensity 8050 vs MediaTek Dimensity 930

Qualcomm Snapdragon 8 Gen 1

The Qualcomm Snapdragon 8 Gen 1 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2021 and manufactured in 4 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X2 architecture clocked at up to 3 GHz. Three more performance cores are based on the Cortex-A710 but clocked up to 2.5 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A510 architecture and clocked at up to 1.8 GHz. All cores can use the shared 6 MB level 3 cache.

Compared to the Snapdragon 888 (Plus), the CPU part gains 20% performance and 30% power savings according to Qualcomm. This means that the Snapdragon 8 Gen 1 is the fastest CPU for Android based smartphones and should be positioned between the Apple A13 and A14 CPU.

The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.

The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.

The integrated Snapdragon X65 5G modem is also new and offers faster transfer rates (up to 10 Gbps download and 3 Gbps upload). The FastConnect 6900 offers support for the current Wifi 6E and Bluetooth 5.2.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

MediaTek Dimensity 930

The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.

The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.