Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 7050 vs MediaTek Dimensity 900
Qualcomm Snapdragon 6 Gen 1
► remove from comparison
The Qualcomm Snapdragon 6 Gen 1 (SM6450) mobile platform was designed for Android-based smartphones and tablets and was launched in September 2022. The SoC (system-on-a-chip) is in the entry-level class and is based on ARM's v9 architecture.
The cryo CPU of the Snapdragon 6 Gen 1 is based on four ARM Cortex-A78 performance cores with clock frequencies of up to 2.2 GHz and an efficiency cluster consisting of four Cortex-A55 cores with a clock frequency of 1.8 GHz.
An Adreno 710 is used as the integrated graphics unit. The Soc also integrates a Spectra ISP (200 MP photo), a dual-channel 16-bit LPDDR 2750 MHz memory controller, an X62 5G modem (max 2.9 GBit/s download, 1.6 Gbit/s upload), a Fastconnect 6700 Wi-Fi 6E / Bluetooth 5.2 modem and Hexagon.
The SoC is manufactured in the modern 4 nm process at Samsung.
MediaTek Dimensity 7050
► remove from comparison
The Mediatek Dimensity 7050 (Mediatek MT8791N/TN) is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.
The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.
The MediaTek Dimensity 7050 is still manufactured in 6 nm.
MediaTek Dimensity 900
► remove from comparison
The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit and video de- and encoding.
The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.
| Model | Qualcomm Snapdragon 6 Gen 1 | MediaTek Dimensity 7050 | MediaTek Dimensity 900 | ||||||||
| Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
| Series | Qualcomm Snapdragon 6 | ||||||||||
| Series: Snapdragon 6 Cortex-A78 / A55 |
| ||||||||||
| Clock | 1800 - 2200 MHz | 2000 - 2600 MHz | 2000 - 2400 MHz | ||||||||
| Cores / Threads | 8 / 8 4 x 2.2 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 | 8 / 8 | ||||||||
| Technology | 4 nm | 6 nm | 6 nm | ||||||||
| Features | 12-Bit Spectra Triple ISP, 7th Gen AI Engine, Wi-Fi 6E, X62 5G Modem | 2x ARM Cortex-A78 (2.6 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | 2x ARM Cortex-A78 (2.4 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | ||||||||
| iGPU | Qualcomm Adreno 710 | ARM Mali-G68 MP4 | ARM Mali-G68 MP4 (900 MHz) | ||||||||
| Architecture | ARM | ARM | ARM | ||||||||
| Announced | |||||||||||
| Manufacturer | www.qualcomm.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 6 Gen 1 → 100% n=19
Average Benchmarks MediaTek Dimensity 7050 → 99% n=19
Average Benchmarks MediaTek Dimensity 900 → 85% n=19
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
