AMD Ryzen 7 7736U vs Apple M3 Pro 11-Core

AMD Ryzen 7 7736U

The AMD Ryzen 7 7736U is a processor for mid-sized laptops based of the Rembrandt refresh generation. The R7 7736U integrates all eight cores based on the Zen 3+ microarchitecture. They are clocked at 2.7 (guaranteed base clock) to 4.75 GHz (Turbo) and support SMT / Hyperthreading (16 threads). The chip is manufactured on the modern 6 nm TSMC process. Compared to the previous Ryzen 7 6800U, the 7736U offers the same specs and a slightly higher possible TDP of 15-28W (vs 15-25W). The 7736U is a special version for HP of the Ryzen 7 7735U / Ryzen 7 6800U.

The Zen 3+ is a refresh of the Zen 3 architecture and should not offer a lot of changes. The chip offers modern features, like support for USB 4 (40 Gbps), PCI-E Gen 4 and DDR5-4800MT/s or LPDDR5-6400MT/s.

The performance should be similar to the old Ryzen 7 6800U due to the same specifications. The Ryzen 7 R7 7735U should be in theory a bit higher due to the 50 MHz higher boost clock.

The integrated GPU Radeon 680M is still one of the fastest iGPUs (only bested by the new Radeon 780M). It is based on the RDNA2 architecture and offers 12 CUs at up to 2.2 GHz.

The Ryzen 7736U is manufactured in 6nm FinFET at TSMC.

Apple M3 Pro 11-Core

The Apple M3 Pro 11 Core is a system on a chip (SoC) from Apple for notebooks that was introduced late 2023. It integrates 11 of the 12 CPU cores with 5 of 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz.

Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). Thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.

The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the entry-level model, only 14 of the chip's 18 cores are used and support up to 3 displays simultaneously (internal and 2 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).