AMD Ryzen 7 7736U vs Apple M3 Max 16-Core

AMD Ryzen 7 7736U

The AMD Ryzen 7 7736U is a processor for mid-sized laptops based of the Rembrandt refresh generation. The R7 7736U integrates all eight cores based on the Zen 3+ microarchitecture. They are clocked at 2.7 (guaranteed base clock) to 4.75 GHz (Turbo) and support SMT / Hyperthreading (16 threads). The chip is manufactured on the modern 6 nm TSMC process. Compared to the previous Ryzen 7 6800U, the 7736U offers the same specs and a slightly higher possible TDP of 15-28W (vs 15-25W). The 7736U is a special version for HP of the Ryzen 7 7735U / Ryzen 7 6800U.

The Zen 3+ is a refresh of the Zen 3 architecture and should not offer a lot of changes. The chip offers modern features, like support for USB 4 (40 Gbps), PCI-E Gen 4 and DDR5-4800MT/s or LPDDR5-6400MT/s.

The performance should be similar to the old Ryzen 7 6800U due to the same specifications. The Ryzen 7 R7 7735U should be in theory a bit higher due to the 50 MHz higher boost clock.

The integrated GPU Radeon 680M is still one of the fastest iGPUs (only bested by the new Radeon 780M). It is based on the RDNA2 architecture and offers 12 CUs at up to 2.2 GHz.

The Ryzen 7736U is manufactured in 6nm FinFET at TSMC.

Apple M3 Max 16-Core

The Apple M3 Max (16 Core) is a system on a chip (SoC) from Apple for notebooks that was launched towards the end of 2023. It integrates a new 16-core CPU with 12 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a slimmed-down 14-core variant with a 30-core GPU.

Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs (such as a Core i9-13900HX).

The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 40 cores of the chip are used and support up to 5 displays simultaneously (internal and 4 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 48, 64 and 128 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max). Under load, the CPU part consumes up to 56 watts, the chip can use a total of 78 watts.