AMD Ryzen 3 3350U vs Intel Core i3-350M vs AMD Ryzen 7 PRO 3700U
AMD Ryzen 3 3350U
► remove from comparison![AMD R3 3350U](fileadmin/_processed_/3/4/csm_ryzen3_badge_9340028343.jpg)
The AMD Ryzen 3 3350U is a mobile SoC that was announced in January 2019. It combines four Zen+ cores (no SMT / Hyperthreading so only 4 threads) clocked at 2.1 - 3.5 GHz with a Radeon RX Vega 6 graphics card with 6 CUs (384 Shaders) clocked at up to 1200 MHz. Specified at 15 Watt TDP, the SoC is intended for thin mid-range laptops. Compared to the similar Ryzen 3 3300U, the 3350U offers the same specifications according to AMD.
The Picasso SoCs use the Zen+ microarchitecture with slight improvements that should lead to a 3% IPS (performance per clock) improvements. Furthermore, the 12nm process allows higher clock rates at similar power consumptions.
The integrated dual-channel memory controller supports up to DDR4-2400 memory. As the features of the Picasso APUs are the same compared to the Raven Ridge predecessors, we point to our Raven Ridge launch article.
AMD states that the Picasso APUs are about 8% faster than the predecessors. Therefore, the Ryzen 3 3350U should be similar to the Ryzen 5 2500U (2 - 3.6 GHz but with SMT).
Intel Core i3-350M
► remove from comparison![Intel 350M](typo3temp/_processed_/2/f/csm_kaigai9_04_6cbbda7a50.jpg)
The Intel Core i3-350M is a lower-middle class dual core CPU for laptops and clocks with 2.26 GHz. The difference to the Core i5-430M is the lacking Turbo Boost overclocking, and the missing AES, VT-d and Trusted Execution functions. Each core is based on the Nehalem (Westmere) micro-architecture. Hyperthreading enables the Dual Core CPU to handle 4 threads at once (for a better usage of the pipeline).
A feature of the new Core i3-350M is the integrated graphics card called GMA HD and the memory controller. Both are on a separate die that is still manufactured in 45nm whereas the CPU die is already manufactured in the new 32nm process.
First performance results from [pconline.com.cn] indicate a very good performance per MHz. The site reviewed the upcoming Core i3 530 (2.93 GHz - no turbo) which was on average faster than a Core 2 Duo E8400 (3.0 GHz). Therefore, the mobile Core i3-350M should be faster than a Core 2 Duo P8400.
The integrated Intel Graphics Media Accelerator HD (GMA HD) graphics card is known to be clocked up to 500-667 MHz (due to Turbo Boost) and should be clearly faster than the old GMA 4500MHD. The Core i5 and i7 models should still be a bit faster because of the higher max. clock speed of the GPU. The performance of the graphics in 3D should be on par with a Radeon HD 4200 but the driver support is usually worse.
The power consumption of 35 Watt TDP (max.) counts for the whole package and therefore it is clearly better than the 35 Watt TDP of the Core 2 Duo T-series (CPU alone).
AMD Ryzen 7 PRO 3700U
► remove from comparison![AMD R7 PRO 3700U](fileadmin/_processed_/d/0/csm_ryzen_pro_chip_3000series_45abf5ed87.jpg)
The AMD Ryzen 7 PRO 3700U is a mobile SoC for business laptops that was announced in April 2019. It combines four Zen+ cores (8 threads) clocked at 2.3 - 4 GHz with a Radeon RX Vega 10 graphics card with 10 CUs (640 Shaders) clocked at up to 1400 MHz. Specified at 15 Watt TDP, the SoC is intended for thin mid-range laptops. Compared to the similar consumer variant Ryzen 7 3700U, the PRO model features additional management and security features (e.g., full memory encryption) and longer warranty / availability.
The Picasso SoCs use the Zen+ microarchitecture with slight improvements that should lead to a 3% IPS (performance per clock) improvements. Furthermore, the 12nm process allows higher clock rates at similar power consumptions.
The integrated dual-channel memory controller supports up to DDR4-2400 memory. As the features of the Picasso APUs are the same compared to the Raven Ridge predecessors, we point to our Raven Ridge launch article.
AMD states that the Picasso APUs are about 8% faster than the predecessors. Therefore, the Ryzen 7 PRO 3700U should be slightly ahead the Ryzen 7 PRO 2700U.
Model | AMD Ryzen 3 3350U | Intel Core i3-350M | AMD Ryzen 7 PRO 3700U | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | AMD Picasso (Ryzen 3000 APU) | Intel Core i3 | AMD Picasso (Ryzen 3000 APU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Zen+ | Arrandale | Zen+ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Picasso (Ryzen 3000 APU) Zen+ |
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Clock | 2100 - 3500 MHz | 2260 MHz | 2300 - 4000 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 384 KB | 384 KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 2 MB | 512 KB | 2 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 4 MB | 3 MB | 4 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 4 / 4 | 2 / 4 | 4 / 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 15 Watt | 35 Watt | 15 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Transistors | 4500 Million | 382+177 Million | 4500 Million | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 12 nm | 32 nm | 12 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 105 °C | 105 °C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | AM4 | BGA1288, PGA988 | AM4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | XFR, FMA3, SSE 4.2, AVX2, SMT | Hyper Threading, Enhanced Speedstep, integrierte GMA HD 667MHz, | XFR, FMA3, SSE 4.2, AVX2, SMT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | AMD Radeon RX Vega 6 (Ryzen 2000/3000) ( - 1200 MHz) | AMD Radeon RX Vega 10 ( - 1400 MHz) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.amd.com | ark.intel.com | www.amd.com | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
FSB | 2500 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 81+114 mm2 |