AMD Ryzen 3 3350U vs Intel Core i3-330UM
AMD Ryzen 3 3350U
► remove from comparison![AMD R3 3350U](fileadmin/_processed_/3/4/csm_ryzen3_badge_9340028343.jpg)
The AMD Ryzen 3 3350U is a mobile SoC that was announced in January 2019. It combines four Zen+ cores (no SMT / Hyperthreading so only 4 threads) clocked at 2.1 - 3.5 GHz with a Radeon RX Vega 6 graphics card with 6 CUs (384 Shaders) clocked at up to 1200 MHz. Specified at 15 Watt TDP, the SoC is intended for thin mid-range laptops. Compared to the similar Ryzen 3 3300U, the 3350U offers the same specifications according to AMD.
The Picasso SoCs use the Zen+ microarchitecture with slight improvements that should lead to a 3% IPS (performance per clock) improvements. Furthermore, the 12nm process allows higher clock rates at similar power consumptions.
The integrated dual-channel memory controller supports up to DDR4-2400 memory. As the features of the Picasso APUs are the same compared to the Raven Ridge predecessors, we point to our Raven Ridge launch article.
AMD states that the Picasso APUs are about 8% faster than the predecessors. Therefore, the Ryzen 3 3350U should be similar to the Ryzen 5 2500U (2 - 3.6 GHz but with SMT).
Intel Core i3-330UM
► remove from comparisonThe Intel Core i3-330UM is a Ultra Low Voltage dual-core processor for small and light laptops. It is clocked with 1.2 GHz and does not feature Turbo Boost to overclock the CPU cores. Another feature missing compared to the i5 and i7 lineup is the AES function block. Each core is based on the Nehalem (Westmere) micro-architecture. Hyperthreading enables the Dual Core CPU to handle 4 threads at once (for a better usage of the pipeline).
A feature of the new Core i3-330UM is the integrated graphics card (called Intel HD Graphics) and memory controller. Both are on a separate die that is still manufactured in 45nm whereas the CPU die is already manufactured in the new 32nm process. The also called GMA HD is able to use Turbo Boost to overclock from 133 to 500 MHz.
Due to the integrated memory controller and HyperThreading, the Core i3-330UM is faster than a similar clocked Core 2 Duo (1.2 GHz) in all (us known) applications and benchmarks. Therefore it should beat the 1.3 GHz Pentium SU7300. Still the gaming performance will suffer from the low clock speed.
The power consumption of 18 Watt TDP (max.) counts for the whole package and therefore it is clearly better than the 17 Watt TDP of the Core 2 Duo SL-series (CPU alone).
Model | AMD Ryzen 3 3350U | Intel Core i3-330UM | ||||||||||||||||||||||||||||||||||||||||||||||||
Series | AMD Picasso (Ryzen 3000 APU) | Intel Core i3 | ||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Zen+ | Arrandale | ||||||||||||||||||||||||||||||||||||||||||||||||
Series: Core i3 Arrandale |
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Clock | 2100 - 3500 MHz | 1200 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 384 KB | |||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 2 MB | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 4 MB | 3 MB | ||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 4 / 4 | 2 / 4 | ||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 15 Watt | 18 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||
Transistors | 4500 Million | 382+177 Million | ||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 12 nm | 32 nm | ||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 105 °C | 105 °C | ||||||||||||||||||||||||||||||||||||||||||||||||
Socket | AM4 | BGA1288 | ||||||||||||||||||||||||||||||||||||||||||||||||
Features | XFR, FMA3, SSE 4.2, AVX2, SMT | Intel HD Graphics 166-500MHz, DDR3-800 Memory Controller, Hyper-Threading, Virtualization Technology VT-x, Intel 64, Idle States, Enhanced Speedstep, Thermal Monitoring, Fast Memory Access, Flex Memory Access, Execute Disable Bit | ||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | AMD Radeon RX Vega 6 (Ryzen 2000/3000) ( - 1200 MHz) | |||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.amd.com | ark.intel.com | ||||||||||||||||||||||||||||||||||||||||||||||||
FSB | 2500 | |||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 81+114 mm2 |