Apple M1 vs MediaTek Dimensity 930 vs MediaTek Dimensity 7030

Apple M1

The Apple M1 is a System on a Chip (SoC) from Apple that is found in the late 2020 MacBook Air, MacBook Pro 13, and Mac Mini. It offers 8 cores divided in four performance cores and four power-efficiency cores. The big cores offer 192 KB instruction cache, 128 KB data cache, and 12 MB shared L2 cache. According to Apple the performance of these cores should be better than anything on the market (in late 2020). The four efficiency cores are a lot smaller and offer only 128 KB instruction cache, 64 KB data cache, and 4 MB shared cache. The efficiency cores (E cluster) clock with 600 - 2064 MHz, the performance cores (P cluster) with 600 - 3204 MHz.

The M1 is available in two TDP variants, a passive cooled 10 Watt variant for the MacBook Air and an active cooled faster variant for the MacBook Pro 13 and Mac Mini. Those should offer a better-sustained performance according to Apple.

The integrated graphics card in the M1 offers 8 cores (7 cores in the entry MacBook Air) and a peak performance of 2.6 teraflops. Apple claims that it is faster than any other iGPU at the time of announcement.

Furthermore, the SoC integrates a fast 16 core neural engine with a peak performance of 11 TOPS (for AI hardware acceleration), a secure enclave (e.g., for encryption), a unified memory architecture, Thunderbolt / USB 4 controller, an ISP, and media de- and encoders.

The Apple M1 includes 16 billion transistors (up from the 10 billion of the A12Z Bionic and therefore double the amount of a Tiger Lake-U chip like the i7-1185G7) and is manufactured in 5nm at TSMC.

MediaTek Dimensity 930

The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.

The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.