Apple M1 Pro 8-Core vs MediaTek Dimensity 8050 vs MediaTek Dimensity 7030

Apple M1 Pro 8-Core

The Apple M1 Pro 8-Core is a System on a Chip (SoC) from Apple that is found in the late 2021 MacBook Pro 14 and 16-inch models. It offers 8 cores from the 10 available in the chip divided in six performance cores (P-cores with 600 - 3220 MHz) and four power-efficiency cores (E-cores with 600 - 2064 MHz). The cores are similar to the cores in the Apple M1.

The big cores (codename Firestorm) offer 192 KB instruction cache, 128 KB data cache, and 24 MB shared L2 cache (up from 12 MB in the M1). The four efficiency cores (codename Icestorm) are a lot smaller and offer only 128 KB instruction cache, 64 KB data cache, and 4 MB shared cache. Finally, the SoC includes 16 MB System Level Cache shared by the GPU. The efficiency cores (E cluster) clock with 600 - 2064 MHz, the performance cores (P cluster) with 600 - 3228 MHz.

The unified memory (16 or 32 GB LPDDR5-6400) next to the chip is connected by a 256 bit memory controller and can be used by the GPU and CPU.

The integrated graphics card in the M1 Pro offers 14 cores (of the 16 cores in the chip).

Furthermore, the SoC integrates a fast 16 core neural engine, a secure enclave (e.g., for encryption), a unified memory architecture, Thunderbolt 4 controller, an ISP, and media de- and encoders (including ProRes).

The M1 Pro is manufactured in 5 nm at TSMC and integrates 33.7 billion transistors. The peak power consumption of the chip was advertised around 30W for CPU intensive tasks.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.