HiSilicon Kirin 9000 vs MediaTek Kompanio 1300T
HiSilicon Kirin 9000
► remove from comparison![Kirin 9000](fileadmin/_processed_/c/b/csm_Huawei_Kirin_9000_1200x675_e9beb424b5.jpg)
The HiSilicon Kirin 9000 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei P40 Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The integrated graphics card is using the Mali-G78 architecture and features all 24 cores (G78MP24).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
MediaTek Kompanio 1300T
► remove from comparison![Mediatek Kompanio 1300T](fileadmin/_processed_/4/2/csm_MediaTek_Kompanio_Chip_Image_Front_3525797762.jpg)
The Mediatek Kompanio 1300T is a fast mid-range SoC with an integrated 5G modem for Android based Tablets. It includes two CPU clusters. Four ARM Cortex-A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. Compared to the Mediatek Dimensity 1300 and Dimensity 1200, there is no faster clocked prime core (of the four A78) and therefore the single thread performance is a lot lower.
Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).
The chip is manufactured in the modern 6nm process and should be very power efficient.
Model | HiSilicon Kirin 9000 | MediaTek Kompanio 1300T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Mediatek | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Cortex-A77/-A55 | Cortex-A78 / A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Cortex-A78 / A55 |
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Clock | 2050 - 3130 MHz | 2000 - 2600 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 5 nm | 6 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | ARM Mali-G78 MP24 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | 1x ARM Cortex-A78 (3 GHz), 3x A78 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC5, APU 3.0, 5G Modem, MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 6, Bluetooth 5.2, UFS 3.1, 16GB-4266 LPDDR4x Support | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | ARM Mali-G78 MP24 | ARM Mali-G77 MP9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.hisilicon.com | www.mediatek.com |