HiSilicon Kirin 9000 vs MediaTek Dimensity 900 vs HiSilicon Kirin 9000E
HiSilicon Kirin 9000
► remove from comparison![Kirin 9000](fileadmin/_processed_/c/b/csm_Huawei_Kirin_9000_1200x675_e9beb424b5.jpg)
The HiSilicon Kirin 9000 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei P40 Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The integrated graphics card is using the Mali-G78 architecture and features all 24 cores (G78MP24).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
MediaTek Dimensity 900
► remove from comparison![Mediatek Dimensity 900](fileadmin/_processed_/b/9/csm_mediatek_dimensity_820_435e3181e1.jpg)
The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit and video de- and encoding.
The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.
HiSilicon Kirin 9000E
► remove from comparison![Kirin 9000E](fileadmin/_processed_/c/b/csm_Huawei_Kirin_9000_1200x675_e9beb424b5.jpg)
The HiSilicon Kirin 9000E is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei MatePad Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The difference to the similar Kirin 9000 is the integrated graphics card, which features only 22 of the 24 clusters (ARM Mali-G78 MP22).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
Model | HiSilicon Kirin 9000 | MediaTek Dimensity 900 | HiSilicon Kirin 9000E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Mediatek | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Cortex-A77/-A55 | Cortex-A78 / A55 | Cortex-A77/-A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Cortex-A77/-A55 |
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Clock | 2050 - 3130 MHz | 2000 - 2400 MHz | 2050 - 3130 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 | 8 / 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 5 nm | 6 nm | 5 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | ARM Mali-G78 MP24 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | 2x ARM Cortex-A78 (2.4 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | ARM Mali-G78 MP22 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | ARM Mali-G78 MP24 | ARM Mali-G68 MP4 (900 MHz) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Manufacturer | www.hisilicon.com | www.mediatek.com | www.hisilicon.com |