The HiSilicon Kirin 9000 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei P40 Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The integrated graphics card is using the Mali-G78 architecture and features all 24 cores (G78MP24).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit and video de- and encoding.
The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.
The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
Average Benchmarks MediaTek Dimensity 900 → 81%n=3
Average Benchmarks MediaTek Dimensity 8050 → 93%n=3
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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