HiSilicon Kirin 9000 vs MediaTek Dimensity 7030
HiSilicon Kirin 9000
► remove from comparison![Kirin 9000](fileadmin/_processed_/c/b/csm_Huawei_Kirin_9000_1200x675_e9beb424b5.jpg)
The HiSilicon Kirin 9000 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei P40 Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The integrated graphics card is using the Mali-G78 architecture and features all 24 cores (G78MP24).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
MediaTek Dimensity 7030
► remove from comparison![Mediatek Dimensity 7030](fileadmin/_processed_/b/1/csm_mediatek-dimensity-5g-chip-generic_58092ef88a.jpg)
The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.
It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.
The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.
Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.
The SoC is manufactured in a 6nm process.
Model | HiSilicon Kirin 9000 | MediaTek Dimensity 7030 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Mediatek | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Cortex-A77/-A55 | Cortex-A78 / A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Cortex-A78 / A55 |
|
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Clock | 2050 - 3130 MHz | 2000 - 2500 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 2 x 2.5 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 5 nm | 6 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | ARM Mali-G78 MP24 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | 2x ARM Cortex-A78 (2.5 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC3, 5G Sub-6 GHz, LTE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | ARM Mali-G78 MP24 | ARM Mali-G610 MP3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.hisilicon.com | www.mediatek.com |