The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower.
The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).
The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).
The Unisoc T760 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Four fast ARM Cortex-A76 cores clocked at up to 2 GHz and four small ARM-Cortex-A55 cores at again up to 2 GHz for efficiency. The faster T770 SoC offers higher clocked A76 cores in comparison (up to 2.5 GHz for a single core).
One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.
The chip is manufactured in the modern 6nm process.
The MediaTek Dimensity 6080 (MT6833V/MT6833GP) is an ARM-based SoC (system-on-a-chip) manufactured by TSMC using the 6 nm process. It was specially designed for use in Android smartphones and is in the lower mid-range in terms of performance. It supports all current mobile communication standards, including 5G Sub6.
The SoC is identical to the MediaTek Dimensity 810 the only difference is that the Dimensity 6080 can cope with a camera resolution of up to 108 megapixels.
The CPU works with a total of eight cores, which are divided into two clusters. One has two ARM Cortex-A76 power cores with up to 2.4 GHz each, while the other has six ARM Cortex-A55 energy-saving cores with up to 2.0 GHz each. LPDDR4x RAM with 2,133 MHz can be used as RAM and UFS 2.2 is supported as internal memory.
In terms of connectivity, dual 5G (Sub6) with a theoretical peak download speed of up to 2.77 GBit/s is available, as well as Wi-Fi 5 and Bluetooth 5.1.
The integrated graphics unit ARM Mali-G57 MP2 can power displays with a resolution of up to 2,520 x 1,080 pixels (Full HD+) and a refresh rate of up to 120 Hz.
Average Benchmarks MediaTek Dimensity 6080 → 160%n=2
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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- Average benchmark values for this graphics card