The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower.
The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).
The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).
The UniSoc T765 is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.
The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.
The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
v1.28
log 01. 22:01:33
#0 checking url part for id 10172 +0s ... 0s
#1 checking url part for id 17142 +0s ... 0s
#2 redirected to Ajax server, took 1719864093 +0s ... 0s
#3 did not recreate cache, as it is less than 5 days old! Created at Mon, 01 Jul 2024 05:15:43 +0200 +0s ... 0s
#4 composed specs +0.052s ... 0.053s
#5 did output specs +0s ... 0.053s
#6 getting avg benchmarks for device 10172 +0.003s ... 0.056s
#7 got single benchmarks 10172 +0.013s ... 0.069s
#8 getting avg benchmarks for device 17142 +0.001s ... 0.07s