HiSilicon Kirin 650 vs Qualcomm Snapdragon 625 vs HiSilicon Kirin 935

HiSilicon Kirin 650

The HiSilicon Kirin 650 is an ARM-based octa-core SoC for mid-range smartphones and tablets. It was announced early 2016 and features eight ARM Cortex-A53 cores. Four cores can be clocked with up to 1.7 GHz (power saving cores) and four with up to 2 GHz (performance cores). Furthermore, a ARM Mali-T830 MP2 graphics card (at 600 MHz with 40.8 GFLOPS), a 64-Bit LPDDR3 memory controller and a dual-sim capable LTE Cat. 6 (max. 300 MBit/s and GSM, WCDMA, UMTS, HSPA+) radio are integrated in the SoC.

The processor performance can be compared with the older Kirin 930 and therefore sufficient for daily usage as browsing and non demanding apps. High-end SoCs with Cortex-A57 or A72 cores however should be noticeably faster.

The SoC is produced in a modern 16nm FinFET process and is therefore very power efficient.

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

HiSilicon Kirin 935

The HiSilicon Kirin 935 is an ARM-based octa-core SoC (system-on-a-chip) for smartphones and tablets. It was launched in the first half of 2015. It integrates two quad-core clusters of Cortex-A53 cores (big.LITTLE). The performance cluster clocks at up to 2.2 GHz, the power saving cluster at up to 1.5 GHz. Furthermore, the SoC integrates a ARM Mali-T628 MP4 graphics card and LTE Cat. 6 modem. The SoC is manufactured in 28nm and thanks to the small Cortex-A53 cores also suited for smaller smartphones.