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MagyarHonor Magic V3 unveiled as leaker shares specs with tantalisingly thin and light design
The Magic V2 (curr. $1,395 on Amazon) is almost a year old, having been originally announced way back in July 2023. For context, this is only true for its Chinese version. By contrast, Honor waited until the start of 2024 before delivering the Magic V2 globally.
As such, it is no surprise to see the company starting to tease the release of a successor. Please note that Honor has not commented on the Magic V3 globally. Instead, it has only revealed early details about the device on Chinese social media. Thus, we suspect that there will be a repeat of last year where Honor announces a new foldable in its home market before presenting the same device months later globally.
So far, Honor has merely stated that the Magic V3 'will raise the bar once again' with a focus on device thinness. According to long-time Huawei and Honor leaker @RODENT950, the Magic V3 will be 6-7 mm thick and will weigh 220-230 g. For reference, the Magic V2 weighs a minimum of 231 g while being between 9.99 and 10.1 mm thick, depending on whether you choose its vegan leather or glass back variant.
Unsurprisingly, the Magic V3 will feature Qualcomm's Snapdragon 8 Gen 3 chipset, which @RODENT950 claims will be complemented by an 'ultra-thin' USB Type-C port that supports 66 W wired charging and a circa 5,000 mAh battery capacity. On top of that, the handset will integrate a 50 MP 'eagle eye camera' and satellite connectivity, albeit just in China. Although a release date remains unknown for now, the release of official teasers suggests that Honor intends to fully unveil the Magic V3 in early to mid-July.
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![We could see the first Samsung Galaxy flagship phone launch with a Dimensity chipset (image source: Samsung and MediaTek [edited])](fileadmin/_processed_/2/e/csm_Galaxy-S25-with-Dimensity-chip_1f308dfdce.jpg)
