Mediatek Helio G70 vs Qualcomm Snapdragon 662 vs Mediatek Helio G85

Mediatek Helio G70

The Mediatek Helio G70 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.7 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 820 MHz. The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.

Compared to the slightly faster Helio G80, the difference to the G70 is the slightly lower clock speed for the A55 cores (-100 MHz) and GPU (-130 MHz).

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.

Qualcomm Snapdragon 662

The Qualcomm Snapdragon 662 is a lower mid-range ARM-based SoC largely found in Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Mediatek Helio G85

The Mediatek Helio G85 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.8 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 1000 MHz (up from 950 MHz from the otherwise similar Helio G80). The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.