The Samsung Exynos 7885 (also called Exynos 7 Series) is a upper mid-range system-on-a-chip (SoC) for smartphones and tablets. It was launched early 2018 alongside the Samsung Galaxy A8 2018 series and features two Cortex-A73 cores clocked at up to 2.2 GHz. Furthermore, there are six power efficient Cortex-A53 cores at up to 1.6 GHz, an ARM Mali-G71 MP2 GPU and a LPDDR4x memory controller. The integrated LTE modem supports LTE Cat.12 3CA 600 Mbps download speeds and Cat.13 2CA 150 Mbps upload. 802.11ac WiFi, Bluetooth 5.0 and FM Radio are also in the chip. It is manufactured in 14nm FinFET at Samsung and therefore a rather power efficient SoC.
The MediaTek Dimensity 8020 is a ARM-based System-on-a-Chip (SoC) similar to the older Dimensity 1100. It was specifically designed for use in Android smartphones and falls into the mid-range category in terms of performance. It supports all current mobile network standards, including 5G with 2CC-CA (200MHz) and FDD+TDD.
The CPU consists of a total of eight cores divided into two clusters. One cluster has four ARM Cortex-A78 performance cores with speeds of up to 2.6 GHz, while the other cluster has four ARM Cortex-A55 power-efficient cores with speeds of up to 2.0 GHz. LPDDR4 RAM can be used as the memory, and it supports UFS 3.1 as the internal storage.
In terms of connectivity, it offers Dual-5G support, as well as Wi-Fi 6 and Bluetooth 5.2.
The integrated graphics unit, ARM Mali-G77 MC9, can power displays with a resolution of up to 2560 x 1080 and a refresh rate of up to 144 Hz (possibly only for Full HD+).
The chip is manufactured by TSMC using the current 6nm process in the mid-range segment.
The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.
Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).
The chip is manufactured in the modern 6nm process and should be very power efficient.
Average Benchmarks MediaTek Dimensity 8020 → 248%n=7
Average Benchmarks MediaTek Dimensity 1300 → 199%n=7
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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