MediaTek Dimensity 930 vs Samsung Exynos 7885 vs MediaTek Dimensity 8020

MediaTek Dimensity 930

The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.

The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.

Samsung Exynos 7885

The Samsung Exynos 7885 (also called Exynos 7 Series) is a upper mid-range system-on-a-chip (SoC) for smartphones and tablets. It was launched early 2018 alongside the Samsung Galaxy A8 2018 series and features two Cortex-A73 cores clocked at up to 2.2 GHz. Furthermore, there are six power efficient Cortex-A53 cores at up to 1.6 GHz, an ARM Mali-G71 MP2 GPU and a LPDDR4x memory controller. The integrated LTE modem supports LTE Cat.12 3CA 600 Mbps download speeds and Cat.13 2CA 150 Mbps upload. 802.11ac WiFi, Bluetooth 5.0 and FM Radio are also in the chip. It is manufactured in 14nm FinFET at Samsung and therefore a rather power efficient SoC.

MediaTek Dimensity 8020

The MediaTek Dimensity 8020 is a ARM-based System-on-a-Chip (SoC) similar to the older Dimensity 1100. It was specifically designed for use in Android smartphones and falls into the mid-range category in terms of performance. It supports all current mobile network standards, including 5G with 2CC-CA (200MHz) and FDD+TDD.

The CPU consists of a total of eight cores divided into two clusters. One cluster has four ARM Cortex-A78 performance cores with speeds of up to 2.6 GHz, while the other cluster has four ARM Cortex-A55 power-efficient cores with speeds of up to 2.0 GHz. LPDDR4 RAM can be used as the memory, and it supports UFS 3.1 as the internal storage.

In terms of connectivity, it offers Dual-5G support, as well as Wi-Fi 6 and Bluetooth 5.2.

The integrated graphics unit, ARM Mali-G77 MC9, can power displays with a resolution of up to 2560 x 1080 and a refresh rate of up to 144 Hz (possibly only for Full HD+).

The chip is manufactured by TSMC using the current 6nm process in the mid-range segment.