MediaTek Dimensity 8200-Ultra vs Qualcomm Snapdragon 7c vs MediaTek Dimensity 8100

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

Qualcomm Snapdragon 7c

The Qualcomm Snapdragon 7c Compute Platform (or SD7c Gen 1) is a ARM based SoC for Windows laptops. It integrates two fast Kryo 495 Gold cores (based on the ARM Cortex-A76 architecture) at up to 2.4 GHz and six small Kryo 495 Silver cores (ARM Cortex-A55) for power efficiency. 

The successor is the Snapdragon 7c Gen 2 which offers slightly higher clock speeds.

The integrated X15 LTE modem supports Cat.12 download (600 MBit/s) and Cat.13 upload speeds (150 MBit/s). Furthermore, Wifi-5 and Bluetooth 5.0 are integrated in the SoC. In addition to the Adreno 618 graphic card, the SoC also integrates a Hexagon 692 NPU.

The chip is produced in 8nm (compared to the more modern 7LPP process of the 8cx) and intended for the use in thin and light laptops without a fan.

MediaTek Dimensity 8100

The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.

The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).

The chip is produced at TSMC in 5nm.