MediaTek Dimensity 8050 vs Apple M1 Max vs MediaTek Dimensity 930

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

Apple M1 Max

The Apple M1 Max is a System on a Chip (SoC) from Apple that is found in the late 2021 MacBook Pro 14 and 16-inch models. It offers all 10 cores available in the chip divided in eight performance cores (P-cores with 600 - 3220 MHz) and two power-efficiency cores (E-cores with 600 - 2064 MHz). There is no Turbo Boost for single cores or short burst periods. The cores are similar to the cores in the Apple M1.

The big cores (codename Firestorm) offer 192 KB instruction cache, 128 KB data cache, and 24 MB shared L2 cache (up from 12 MB in the M1). The four efficiency cores (codename Icestorm) are a lot smaller and offer only 128 KB instruction cache, 64 KB data cache, and 4 MB shared cache. CPU and GPU can both use the 48 MB SLC (System Level Cache). The efficiency cores (E cluster) clock with 600 - 2064 MHz, the performance cores (P cluster) with 600 - 3228 MHz.

The unified memory (32 or 64 GB LPDDR5-6400) next to the chip is connected by a 512 bit memory controller (200 GB/s bandwidth) and can be used by the GPU and CPU. This is the main difference to the M1 Pro and the CPU performance is quite similar.

The biggest difference to the M1 Pro is the bigger integrated GPU with 24 or 32 cores (up from 16).

Furthermore, the SoC integrates a fast 16 core neural engine, a secure enclave (e.g., for encryption), a unified memory architecture, Thunderbolt 4 controller, an ISP, and media de- and encoders (including two ProRes engines).

The M1 Pro is manufactured in 5 nm at TSMC and integrates 57 billion transistors. The peak power consumption of the chip was advertised around 30W for CPU intensive tasks. 

MediaTek Dimensity 930

The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.

The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.