MediaTek Dimensity 8050 vs Samsung Exynos W930 vs MediaTek Dimensity 900

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

Samsung Exynos W930

The Samsung Exynos W930 is a SoC intended for smartwatches that was announced in mid 2023. It integrates two small ARM Cortex-A55 CPU cores at up to 1.4 GHz and an ARM Mali-G68MP2 GPU. The integrated LTE modem supports Cat.4 Download (150 Mbps) and Cat.5 Upload (75 Mbps). For satellite positioning, the SoC supports GPS, GLONASS, Beidou and Galileo. Furthermore, the package integrates 2GB LPDDR4 RAM and 16 GB eMMC.

The chip is manufactured in the relatively modern 5nm process at Samsung.

MediaTek Dimensity 900

The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.