MediaTek Dimensity 7030 vs Samsung Exynos 1380 vs MediaTek Dimensity 8050

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.

Samsung Exynos 1380

The Samsung Exynos 1380 is a system on a chip (SoC) designed for mid-range smartphones and tablets running on the Android operating system. The CPU is made up of two clusters, each consisting of four cores. It features four Cortex-A78 performance cores (up to 2.4 GHz) and four Cortex-A55 power-saving cores (up to 2.0 GHz). The integrated graphics unit is an ARM Mali-G68 MP5 with speeds of up to 950 MHz.

The NPU's performance has been improved by around 14 percent compared to its predecessor, with a capacity of 4.9 TOPS. Displays with up to 144 Hz and Full HD+ resolution can now be used, and the chipset supports cameras with up to 200 MPix. The chipset also includes Wi-Fi 6 and Bluetooth 5.3. Both LPDDR4x and LPDDR5 can be used as RAM, and UFS 3.1 is possible as internal storage.

The integrated modem has significantly increased download speeds, supporting both 5G-Sub6 (download: up to 3.79 Gbps (+32%), upload: up to 1.28 Gbps) and 5G-mmWave (download: up to 3.67 Gbps (+75%), upload: up to 0.92 Gbps). The upload speed for LTE (Cat. 18, download: up to 1.2 Gbps, upload: up to 0.211 Gbps (+5%)) has only been slightly improved.

The Exynos 1380 is manufactured by Samsung using the 5-nm process.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.