The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.
The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.
On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.
The MediaTek Dimensity 6080 (MT6833V/MT6833GP) is an ARM-based SoC (system-on-a-chip) manufactured by TSMC using the 6 nm process. It was specially designed for use in Android smartphones and is in the lower mid-range in terms of performance. It supports all current mobile communication standards, including 5G Sub6.
The SoC is identical to the MediaTek Dimensity 810 the only difference is that the Dimensity 6080 can cope with a camera resolution of up to 108 megapixels.
The CPU works with a total of eight cores, which are divided into two clusters. One has two ARM Cortex-A76 power cores with up to 2.4 GHz each, while the other has six ARM Cortex-A55 energy-saving cores with up to 2.0 GHz each. LPDDR4x RAM with 2,133 MHz can be used as RAM and UFS 2.2 is supported as internal memory.
In terms of connectivity, dual 5G (Sub6) with a theoretical peak download speed of up to 2.77 GBit/s is available, as well as Wi-Fi 5 and Bluetooth 5.1.
The integrated graphics unit ARM Mali-G57 MP2 can power displays with a resolution of up to 2,520 x 1,080 pixels (Full HD+) and a refresh rate of up to 120 Hz.
Average Benchmarks MediaTek Dimensity 6100+ → 100%n=3
Average Benchmarks HiSilicon Kirin 970 → 77%n=3
Average Benchmarks MediaTek Dimensity 6080 → 107%n=3
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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