MediaTek Dimensity 6100+ vs HiSilicon Kirin 960s vs HiSilicon Kirin 960

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

HiSilicon Kirin 960s

The HiSilicon Kirin 960S is an ARM based mid-range octa-core SoC for smartphones and tablets, which was introduced with the 2018 10.5-inch Huawei MediaPad M5. Compared to the normal Kirin 960, the 960S offers an additional NPU for AI calculations from the Kirin 970. Looks like to be slower clocked than the older Kirin 960.

Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.

HiSilicon Kirin 960

The HiSilicon Kirin 960 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 9 in November 2016. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.