MediaTek Dimensity 6100+ vs HiSilicon Kirin 710A vs HiSilicon Kirin 710

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

HiSilicon Kirin 710A

The HiSilicon Kirin 710A is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It is based on the Kirin 710, but manufactured in 14nm FinFET at SMIC (China) versus the TSMC in 12nm. It was announced mid 2020 and contains 8 processor cores (4x Cortex-A73 at up to 2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).