The Mediatek Dimensity 6020 is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC.
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 6020 is manufactured in the older 7nm process like the Dimensity 700.
The AMD Ryzen 3 5300U (not to be confused with the A4-5300, a CPU released in 2012) is a Lucienne family processor designed for use in thin and light laptops. The R3 5300U integrates four cores (quad core) based on the Zen 2 microarchitecture. They are clocked at 2.6 (guaranteed base clock) to 3.8 GHz (Turbo) and support SMT for a total of 8 threads. The chip is manufactured on the modern 7 nm TSMC process. Compared to the older and similar Ryzen 3 4300U (Renoir), the Ryzen 3 5300U offers SMT and slightly higher clock speeds. The faster Ryzen 3 5400U is based on the newer Zen 3 architecture. See our hub page on the Renoir Processors for more information on the Lucienne / Renoir architecture.
In addition to the four CPU cores, the APU also integrates a Radeon RX Vega 6 integrated graphics adapter with 6 CUs at up to 1500 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 4 MB level 3 cache can be found on the chip.
Performance
The average 5300U in our database matches the Core i5-11300H, the Core i7-11375H and also the Ryzen 5 4500U in multi-thread performance, making it an outstandingly good chip as far as sub-US$700 laptops go.
Your mileage may vary depending on how high the CPU power limits are and how competent the cooling solution of your system is.
Power consumption
The Ryzen 3 series chip has a default TDP of 15 W, a value that laptop makers are allowed to change to anything between 10 W and 25 W with clock speeds and performance changing accordingly as a result. By going for the lowest value possible, it will be possible to build a passively cooled system around the chip, however, most companies will do the opposite to achieve higher performance levels.
The AMD Ryzen 3 5300U is built with TSMC's 7 nm manufacturing process for average, as of mid 2023, energy efficiency.
The Unisoc T750 (Tanggula, former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Two fast ARM Cortex-A76 cores clocked at up to 2 GHz and six small ARM-Cortex-A55 cores at again up to 1.8 GHz for efficiency. The faster T760 SoC offers two more A76 cores, a faster GPU and a faster memory controller.
The integrated memory controller supports LPDDR4X with up to 1866 MHz. The integrated ISP supports two main cameras (up to 64 MPix). The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) at up to 680 MHz. The integrated modem supports Wi-Fi 5 WLAN, 5G (TDD+FDD CA Sub-6GHz), and Cat15DL / Cat18 UL LTE.
The chip is manufactured in the modern 6nm process.
Average Benchmarks MediaTek Dimensity 6020 → 100%n=2
Average Benchmarks AMD Ryzen 3 5300U → 210%n=2
Average Benchmarks UNISOC T750 → 83%n=2
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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