Apple M3 Pro 12-Core vs Intel Core i7-11375H
Apple M3 Pro 12-Core
► remove from comparison![Apple Apple M3 Pro 12-Core](fileadmin/_processed_/3/6/csm_m3_soc_18fe44e71f.png)
The Apple M3 Pro (12 Core) is a system on a chip (SoC) from Apple for notebooks that was launched in late 2023. It integrates a new 12-core CPU with 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz. There is also a slimmed-down 11-core variant with a 14-core GPU.
Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). However, thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.
The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 18 cores of the chip are used and support up to 3 displays simultaneously (internal and 2 external).
GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).
The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.
Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).
The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).
Intel Core i7-11375H
► remove from comparison![Intel i7-11375H](fileadmin/_processed_/e/8/csm_11th_Gen_Intel_Core_processors_with_Intel_Iris_Xe_graphics_aa51792d65.jpg)
The Intel Core i7-11375H is a high end quad core SoC for thin and light gaming laptops and mobile workstations. It is based on the Tiger Lake H35 generation and was announced early 2021. It integrates four Willow Cove processor cores (8 threads thanks to HyperThreading). The base clock speed depends on the TDP setting and can vary from 3 (28 W TDP) to 3.3 GHz (35 W). Compared to the i7-11370H, the only difference is the additional Turbo Boost 3.0 for a single core. With it, the 11375H can clock up to 5 GHz. Two cores can clock up to 4.8 GHz (as the 11370H) and all four cores can reach up to 4.3 GHz. The 11375H can use the whole 12 MB level 3 cache.
The processor performance of the i7 should be very similar to the i7-11370H. Only single threaded short workloads will be slightly faster. The multi-threaded performance should be clearly higher than the old Core i5-10400H (Comet Lake, fastest quad core of the 10th gen) due to the new processor architecture. The similar Core i7-1185G7 offers similar specs as the 11370H but a lower TDP and therefore also lower (sustained) performance.
The SoC also included the improved Xe graphics adapter with all 96 EUs clocked at up to 1350 MHz.
Furthermore, Tiger Lake SoCs add PCIe 4 support (four lanes), AI hardware acceleration, and the partial integration of Thunderbolt 4/USB 4 and Wi-Fi 6 in the chip.
The chip is produced on the improved 10nm process (called 10nm SuperFin) at Intel, which should be comparable to the 7nm process at TSMC (e.g. Ryzen 4000 series).
All articles on Tiger Lake can be found on our Tiger Lake architecture hub.
Model | Apple M3 Pro 12-Core | Intel Core i7-11375H | ||||||||||||||||||||||||||||||||||||||||
Series | Apple Apple M3 | Intel Tiger Lake | ||||||||||||||||||||||||||||||||||||||||
Series: Tiger Lake Tiger Lake-H35 |
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Clock | 2748 - 4056 MHz | 3300 - 5000 MHz | ||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 12 / 12 6 x 4.1 GHz Apple M3 P-Core 6 x 2.7 GHz Apple M3 E-Core | 4 / 8 | ||||||||||||||||||||||||||||||||||||||||
TDP | 27 Watt | 35 Watt | ||||||||||||||||||||||||||||||||||||||||
Transistors | 37000 Million | |||||||||||||||||||||||||||||||||||||||||
Technology | 3 nm | 10 nm | ||||||||||||||||||||||||||||||||||||||||
Features | ARMv8 Instruction Set | DDR4-3200/LPDDR4x-4266 RAM, PCIe 4, 4 GT/s bus, DL Boost, GNA, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, VMX, SMEP, SMAP, EIST, TM1, TM2, Hyper-Threading, Turbo, SST, AES-NI, RDRAND, RDSEED, SHA | ||||||||||||||||||||||||||||||||||||||||
iGPU | Apple M3 Pro 18-Core GPU | Intel Iris Xe Graphics G7 96EUs (400 - 1350 MHz) | ||||||||||||||||||||||||||||||||||||||||
Architecture | ARM | x86 | ||||||||||||||||||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.apple.com | ark.intel.com | ||||||||||||||||||||||||||||||||||||||||
Codename | Tiger Lake-H35 | |||||||||||||||||||||||||||||||||||||||||
L1 Cache | 320 KB | |||||||||||||||||||||||||||||||||||||||||
L2 Cache | 5 MB | |||||||||||||||||||||||||||||||||||||||||
L3 Cache | 12 MB | |||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | |||||||||||||||||||||||||||||||||||||||||
Socket | BGA1449 | |||||||||||||||||||||||||||||||||||||||||
$482 U.S. |