Apple M3 Pro 11-Core vs Intel Celeron N5105 vs Apple M3 Max 16-Core

Apple M3 Pro 11-Core

The Apple M3 Pro 11 Core is a system on a chip (SoC) from Apple for notebooks that was introduced late 2023. It integrates 11 of the 12 CPU cores with 5 of 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz.

Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). Thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.

The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the entry-level model, only 14 of the chip's 18 cores are used and support up to 3 displays simultaneously (internal and 2 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).

Intel Celeron N5105

The Intel Celeron N5105 is a quad-core SoC of the Jasper Lake series that is primarily intended for inexpensive desktops and was announced in early 2021. The four Tremont CPU cores clock between 2 and 2.9 GHz (single core Burst) and offer no HyperThreading (SMT). The N5105 uses 1.5 MB L2 and 4 MB L3 cache. The chip is manufactured in 10nm at Intel (most likely in the same process as Ice Lake).

CPU Architecture

The processor architecture is called Tremont and a complete redesign compared to the old Golmont Plus cores in the predecessor. According to Intel, the single thread performance of a core could be improved by 30% on average (10 - 80% in all tests of SPECint and SPECfp).

Features

In addition to the quad-core CPU block, the SoC integrates a 24 EU Intel UHD Graphics GPU clocked from 450 - 800 MHz and a LPDDR4(x) dual channel memory controller (up to 16 GB and 2933 MHz). The chip now also partly integrates Wi-Fi 6 (Gig+), 8 PCIe 3.0 lanes, 14 USB 2.0/ 3.2 ports and two SATA 6.0 ports. The package got bigger and measures 35 x 24 mm (compared to 25 x 24 mm for the N5030 e.g.). The SoC is directly soldered to the mainboard (BGA) and can't be easily replaced.

Performance

The average N5105 in our database is in the same league as the Core i3-1005G1 and the Ryzen 3 3250U, as far as multi-thread benchmark scores are concerned. Your mileage may vary depending on how high the CPU power limits are.

Power Consumption

Similar to the predecessor, Intel specifies the TDP with 10 Watts (mobile and lower clocked N5100 6W). The chip can therefore be cooled passively in theory, but SKUs with fans are possible as well.

Apple M3 Max 16-Core

The Apple M3 Max (16 Core) is a system on a chip (SoC) from Apple for notebooks that was launched towards the end of 2023. It integrates a new 16-core CPU with 12 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a slimmed-down 14-core variant with a 30-core GPU.

Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs (such as a Core i9-13900HX).

The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 40 cores of the chip are used and support up to 5 displays simultaneously (internal and 4 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 48, 64 and 128 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max). Under load, the CPU part consumes up to 56 watts, the chip can use a total of 78 watts.