The Apple A9 is a high-end dual-core ARM SoC for smartphones. It was announced in Sept. 2015 in the new iPhone 6s and 6s Plus. Technical details were not published, but the CPU part should be about 70% and the GPU 90% faster than the previous Apple A8. Therefore, the performance should be on par with high-end Android SoCs in 2015.
It is based on the third generation of Apples 64 Bit architectures (Cyclone 3?) and uses a "new transistor technology". It is manufactured at Samsung in 14nm (slightly smaller die) and TSMC at 16nm (both FINFET 3D transistors). A performance difference of both versions are not noticable.
Furthermore, the chip now integrates the M9 motion coprocessor and a 4K video de- and encoder (as the iPhones 6s supports 4K video recording). The integrated graphics card should be still based on PowerVR technology.
The power consumption could be lower than the A8 due to the new process technology and the fact that the iPhones now got a smaller battery (due to the haptic engine part).
The Apple M3 Max 14 core CPU is a system on a chip (SoC) from Apple for notebooks that was introduced towards the end of 2023. It integrates a new 14-core CPU with 10 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a more powerful 16-core variant with 40 GPU cores.
Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs.
The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the cheaper model, 30 of the chip's 40 cores are used and support up to 5 displays simultaneously (internal and 4 external).
GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 36 and 96 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).
The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.
Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).
The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max).
The Apple M3 Max (16 Core) is a system on a chip (SoC) from Apple for notebooks that was launched towards the end of 2023. It integrates a new 16-core CPU with 12 performance cores with up to 4.06 GHz and 4 efficiency cores with 2.8 GHz. There is also a slimmed-down 14-core variant with a 30-core GPU.
Thanks to the higher clock rates and architectural improvements, the processor performance is also significantly better than the M2 Max in benchmarks and can keep up with the fastest mobile CPUs (such as a Core i9-13900HX).
The M3 also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 40 cores of the chip are used and support up to 5 displays simultaneously (internal and 4 external).
GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 48, 64 and 128 GB variants and offers 400 GB/s maximum bandwidth (512 bit bus).
The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded. Like its predecessor, the Max chip offers two video engines and can therefore encode and decode two streams simultaneously.
Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).
The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 92 billion transistors (+37% vs. Apple M2 Max). Under load, the CPU part consumes up to 56 watts, the chip can use a total of 78 watts.
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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