Qualcomm Snapdragon 625 vs HiSilicon Kirin 658

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

HiSilicon Kirin 658

The HiSilicon Kirin 658 is an ARM-based octa-core SoC for mid-range smartphones and tablets. It was announced early 2017 and features eight ARM Cortex-A53 cores. Four cores can be clocked with up to 1.7 GHz (power saving cores) and four with up to 2.35 GHz (performance cores). The difference to the older Kirin 650 and Kirin 655 SoCs is the higher clock speed of the performance cores (2.35 versus 2.1 and 2.0 GHz).

Furthermore, a ARM Mali-T830 MP2 graphics card (at 900 MHz with 40.8 GFLOPS), a 64-Bit LPDDR3 memory controller and a dual-sim capable LTE Cat. 6 (max. 300 MBit/s and GSM, WCDMA, UMTS, HSPA+) radio are integrated in the SoC. The processor performance can be compared with the older Kirin 930 and therefore sufficient for daily usage as browsing and non demanding apps. High-end SoCs with Cortex-A57 or A72 cores however should be noticeably faster. The SoC is produced in a modern 16nm FinFET process and is therefore very power efficient.