Intel Core i3-6100H vs Intel Pentium Gold 4415U vs Intel Core i3-6100U

Intel Core i3-6100H

The Intel Core i3-6100H is a dual-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.

Architecture

Skylake replaces both Haswell and Broadwell and brings the same microarchitecture in every TDP class from 4.5 to 45 W. The extensive improvements of the Skylake design include increased out-of-order buffers, optimized prefetching and branch prediction as well as additional performance gains through Hyper-Threading. Overall, however, performance per clock has been increased by only 5 to 10 percent (compared to Haswell) respectively under 5 percent (compard to Broadwell), which is quite modest for a new architecture ("Tock").

Furthermore, the organisation of the eDRAM cache has been modified. Instead of acting like a victim cache, which has to be adressed via the L3/LLC, the eDRAM can now be adressed directly by programms just like the main memory. The size is still 128 MB for the quad-core models (4C + GT4e), while the dual-core chips (2C + GT3e) only offer 64 MB.

Performance

According to the specified clock rates and the improved architecture, the Core i3-6100H performs similar to a Core i5-5300U (Broadwell, 15 W) or Core i7-4510U (Haswell, 15 W). Thus, the CPU has sufficient power for office and multimedia purposes as well as more demanding applications and multitasking.

Graphics

The integrated graphics unit called HD Graphics 530 represents the "GT2" version of the Skylake GPU (Intel Gen. 9). The 24 Execution Units, also called EUs, are clocked at 350 - 900 MHz and offer a performance about 20 percent above the old HD Graphics 4600. Games of 2015 can thus be played smoothly in low or medium settings. For more information about performance and features, check our page for the HD Graphics 530.

Power Consumption

Specified at a TDP of 35 W (including CPU, GPU and memory controller), the CPU is best suited for medium-sized notebooks (13-inches and above).

Intel Pentium Gold 4415U

The Intel Pentium 4415U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the more expensive Core i3-7100U, the 4415U offers a similar CPU performance (2.3 versus 2.4 GHz) and less level 3 cache but a slower integrated graphics card. Still, the CPU has sufficient power for office and multimedia purposes as well as somewhat more demanding applications.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 950 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.

Intel Core i3-6100U

The Intel Core i3-6100U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 520 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Skylake replaces both Haswell and Broadwell and brings the same microarchitecture in every TDP class from 4.5 to 45 W. The extensive improvements of the Skylake design include increased out-of-order buffers, optimized prefetching and branch prediction as well as additional performance gains through Hyper-Threading. Overall, however, performance per clock has been increased by only 5 to 10 percent (compared to Haswell) respectively under 5 percent (compard to Broadwell), which is quite modest for a new architecture ("Tock").

Performance

According to the specified clock rates and the improved architecture, the Core i3-6100U should perform just slightly below the former Core i5-4200U (Haswell, 15 W). Thus, the CPU has sufficient power for office and multimedia purposes as well as more demanding applications and light multitasking.

Graphics

The integrated graphics unit called HD Graphics 520 represents the "GT2" version of the Skylake GPU (Intel Gen. 9). The 24 Execution Units, also called EUs, are clocked at 300 - 1000 MHz and offer a performance somewhere in range of a dedicated GeForce 820M. Games of 2015 can thus be played smoothly in low settings. For more information about performance and features, check our page for the HD Graphics 520.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 7.5 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.