Intel Core i7-4900MQ vs Intel Celeron 3867U

Intel Core i7-4900MQ

Intel Celeron 3867U

The Intel Celeron 3865U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores clocked at 1.8 GHz (no Turbo Boost, no HyperThreading), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Compared to the similar Celeron 3865, the 3867 offers a different cTDP-down option (12.5 versus 10 Watt).

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be noticeably slower than the Celeron 3965 which offers 400 MHz higher clocked CPU cores. Therefore, the CPU is only suited for entry level tasks like office, web surfing and multimedia.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.