The Qualcomm Snapdragon 435 (SD435) is a lower mainstream SoC for (Android based) smartphones and tablets. Contrary to the Snapdragon 630, it is still manufactured in a 28-nm process and also consists of an octa-core CPU part with ARM Cortex-A53 cores. However, they are only clocked at up to 1.4 GHz. The integrated X9 LTE modem supports Cat. 4 with maximum transfer rates of 300 Mbps (downstream) and 100 Mbps (upstream). The SoC also includes an Adreno 505 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 clocked at 800 MHz (so probably dual-channel DDRL-1600). The main difference to the Snapdragon 430 is the faster LTE modem.
ARM Mali 2D/3D graphics accelerator, DDR / DDR2 / LP-DDR2 / LP-DDR2 memory interface, LVDS Transmitter, HDMI 1.4, Composite TV-Out (NTSC / PAL), USB 2.0 HS OTG, USB 2.0 host, USB 1.1 HOST, EHI (External Host Interface), UART, NAND Flash Interface
Telechips' TCC88xx application processor will redefine the mobile device of tomorrow with new' innovative user experience by PC-like web browsing, 1080p full HD video record & playback, intuitive user interfaces, location based services and next generation social networking applications. TCC88xx supports development of planned features for the Tablet PC and HMP of tomorrow with tremendous performance and programmability to support new applications yet to be imagined. TCC88xx is equipped with hardwired VPU/GPU/ISP to maximize multimedia experience at its peak level.
The HiSilicon Kirin 9000W is an SoC that can be used in smartphones and tablets based on Android and was first installed in the Huawei MatePad Pro 13.2.
Huawei does not reveal any information about the SoC. The little information that is available comes from benchmarks and system analysis tools. The CPU consists of three clusters with a total of 12 cores. The power-saving cluster has four ARM Cortex-A510 cores, each operating at up to 1,530 MHz, while six other cores use unspecified cores from HiSilicon (0x0D42) and clock at up to 2,150 MHz. The third cluster contains two HiSilicon cores (0x0D02), each with a maximum clock speed of 2,487 MHz. The performance cores could possibly be based on the TaiShan V120 architecture (as in the Kirin 9000S).
The single-core performance is correspondingly mixed, but the multi-core performance is at the level of a high-end SoC from 2022 due to the numerous cores.
A Maleoon 910 by HiSilicon is integrated as the graphics unit, similar to the 9000S (where it was clocked with up to 750MHz).
Nothing concrete is known about the manufacturing process or the architecture. The SoC will probably be manufactured in 7 nm at SMIC.
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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