The Qualcomm Snapdragon 435 (SD435) is a lower mainstream SoC for (Android based) smartphones and tablets. Contrary to the Snapdragon 630, it is still manufactured in a 28-nm process and also consists of an octa-core CPU part with ARM Cortex-A53 cores. However, they are only clocked at up to 1.4 GHz. The integrated X9 LTE modem supports Cat. 4 with maximum transfer rates of 300 Mbps (downstream) and 100 Mbps (upstream). The SoC also includes an Adreno 505 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 clocked at 800 MHz (so probably dual-channel DDRL-1600). The main difference to the Snapdragon 430 is the faster LTE modem.
The Rockchip RK3288 is a mid-range ARM SoC for Android and Chrome OS mobile systems. It integrates four Cortex-A12 cores clocked at up to 1.8 GHz. ARM calls these cores Cortex-A17 due to them having very similar performance levels. The SoC includes an ARM Mali-T760 MP4 (also called Mali-T764) GPU clocked at 600 MHz and a dual-channel DDR3, DDR3L, LPDDR2, LPDDR3 memory controller.
The ARM Cortex-A12 is the successor to the Cortex-A9 and is based on a 32 Bit ARMv7-A microarchitecture. A single A12 core should be roughly 40 % more powerful than an A9 core according to ARM.
The integrated video engine supports encoding of H.264, VP8, and MVC videos up to 1080p. Decoding is supported for videos up to 4K H.264 and 10 Bit H.265.
The chip is manufactured under a 28 nm HKMG process.
The HiSilicon Kirin 9000W is an SoC that can be used in smartphones and tablets based on Android and was first installed in the Huawei MatePad Pro 13.2.
Huawei does not reveal any information about the SoC. The little information that is available comes from benchmarks and system analysis tools. The CPU consists of three clusters with a total of 12 cores. The power-saving cluster has four ARM Cortex-A510 cores, each operating at up to 1,530 MHz, while six other cores use unspecified cores from HiSilicon (0x0D42) and clock at up to 2,150 MHz. The third cluster contains two HiSilicon cores (0x0D02), each with a maximum clock speed of 2,487 MHz. The performance cores could possibly be based on the TaiShan V120 architecture (as in the Kirin 9000S).
The single-core performance is correspondingly mixed, but the multi-core performance is at the level of a high-end SoC from 2022 due to the numerous cores.
A Maleoon 910 by HiSilicon is integrated as the graphics unit, similar to the 9000S (where it was clocked with up to 750MHz).
Nothing concrete is known about the manufacturing process or the architecture. The SoC will probably be manufactured in 7 nm at SMIC.
Average Benchmarks Qualcomm Snapdragon 435 → 100%n=3
Average Benchmarks Rockchip RK3288 → 149%n=3
Average Benchmarks HiSilicon Kirin 9000W → 433%n=3
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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