The HiSilicon Kirin 990 5G is an ARM based high-end octa-core SoC for smartphones and tablets, which was introduced with the Huawei Mate 30 Pro in late 2019. It integrates eight CPU cores in three clusters. The performance cluster contains two Cortex-A76 cores with up to 2.86 GHz, the balanced cluster contains also two Cortex-A76 cores but with only up to 2.36 GHz and finally the power saving cluster contains four small ARM Cortex-A55 cores with up to 1.95 GHz. Furthermore, the SoC integrates a neural processor (2 + 1 cores) for AI tasks and a ARM Mali-G76 MP16 GPU clocked at up to 700 MHz. Compared to the 4G version, the 5G Kirin 990 integrates a Balong 5G modem and is slightly higher clocked (2 of the 3 clusters and the GPU).
The Kirin 990 5G is produced in the modern 7nm (7FF+ with EUV) process at TSMC, the 4G version is still produced in the slightly older 7nm process as the Kirin 980.
The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.
The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.
The HiSilicon Kirin 820e is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced 2022 and contains 8 processor cores. One fast ARM Cortex-A76 core with up to 2.22 GHz, three addition A76 cores at up to 2 and four efficiency Cortex-A55 cores at up to 1.84 GHz. Furthermore, the SoC integrates a 5G modem and a fast mid-range ARM Mali-G57 MP6 graphics card. For AI acceleration, the Kirin 820 integrates a DaVinci NPU. Compared to the similar named Kirin 820, the 820e offers slower clocked CPU cores on a level with the older Kirin 810.
The chip should also integrate Bluetooth 5 and WiFi 6.
The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.
ARM Mali-G52 MP6 GPU, 1x Cortex-A76 up to 2.22 GHz, 3x A76 nup to 2.2 GHz, 4x A55 up to 1.84 GHz, big.LITTLE, 5G TDD/FDD, Bluetooth 5, WiFi 6, AGPS, Glonass, Baidou
Average Benchmarks HiSilicon Kirin 990 5G → 100%n=8
Average Benchmarks HiSilicon Kirin 810 → 75%n=8
Average Benchmarks HiSilicon Kirin 820e → 76%n=8
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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